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However, it is important to note that pro-active SGT can result ultimately in significant cost savings.
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
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The document sets forth methodologies for determining the usage environment at the system level – designing representative board and component-level tests that can be used to judge robustness for the application.
This is critical during the early stages of the transition, a time when the 97003 has limited data on the effects of new elements introduced in the PCB, components and solder joints. The document also provides reference strain limits.
Removing components can alter the mechanical response of the board, repositioning gages can result in irrelevant strain. In addition to BGA components, SGT also is an invaluable tool for analyzing failures on other discrete surface mount devices, such ioc capacitors and resistors. However, before the industry can fully realize the benefits of SGT, there are more hurdles that should be overcome.
Strain Gage Testing: Standardization
Of particular concern is the impact of lead-free solder on the reliability of PCBA interconnects. As we approach the July lead-free deadline, the transition to lead-free processes continues to cause anxiety. Withoutabox Submit to Film Festivals.
This data also can aid board designers when placing critical packages. Partial cracking, however, is not detected easily with non-destructive testing, and often appears only in field returns. These concerns demand that the bending and flexure of the PCB during assembly, test, handling and transportation, as well as actual product application, be characterized and controlled closely to safeguard the reliability of the lead-free PCBA interconnection.
Get to Know Us. Amazon Renewed Refurbished products with a warranty. As the electronics industry shifts toward ipv BGA components, thinner PCBs and lead-free interconnects, the robustness of second-level interconnects SLIs may be affected adversely. With the insight that this data provides, companies are better positioned to design and manufacture more mechanically reliable products.
This also reduces downtime due to electrical and functional test failures. Learn more about Amazon Prime. Standardization December 31, Related Video Included. View shipping rates and policies Average Customer Review: Discover Prime Book Box for Kids.
97703 Second Chance Pass it on, trade it in, give it a second life. While strain measurement of ICT fixtures is a critical application of SGT, adoption by test-fixture vendors is limited.
Mechanical shock test guidelines for solder joint reliability – CERN Document Server
Smaller gage sizes can be more susceptible to variations in the board structure and localized strain concentration. Board-flexure control using strain gage measurement has become an effective method for preventing these failures. It is clear that more research is required before the industry can agree on a common approach to strain limits. While BGA package and overall system-design trends have decreased flexure tolerances, the switch to lead-free solder alloys has introduced fresh concerns.
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. Mudasir Ahmad, manufacturing engineer, Cisco Systems, may be contacted at ; mudasir. Explore the Home Gift Guide. Amazon Drive Cloud storage from Amazon. When paired with computational analysis techniques, SGT provides i;c on the stresses that critical packages are subjected to during such conditions. Unfortunately, variations in methodology inhibit reliable data collection and prevent data comparison.
ComiXology Thousands of Digital Comics. For many 97033, cost is an important factor when implementing routine SGT on their fixtures.