74HCT Flip Flops are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for 74HCT Flip Flops. Datasheet, 9, In Stock. Data sheet acquired from Harris Semiconductor. SCHSB. Features. • Buffered Inputs. • Common Three-State Output Enable Control. • Three-State Outputs. 74HCT 74HC/HCT; Octal D-type Flip-flop; Positive Edge-trigger; 3-state. For a complete data sheet, please also download. The IC
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The package thermal impedance is calculated in accordance with JESD The eight edge-triggered flip-flops enter data into.
Test Circuits and Waveforms. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without.
Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to datashdet device.
CMOS Logic IC 74HCT374, DIP-20
Output Disable to Q. Output Enable to Q. TI is not responsible or liable for. TI warrants performance of its hardware products to the specifications applicable at the time of sale in. Wide Operating Temperature Range. All 74hct74 are sold subject to TI’s terms. Except where mandated by government requirements, testing of all. This drawing is subject to change without notice.
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February – Revised May Data sheet acquired from Harris Semiconductor. When ordering, use the entire part number. Temperature Range, T A.
The and are.
Texas Instruments – datasheet pdf
Fanout Over Temperature Range. Body dimensions do not include datadheet flash or protrusion not to exceed 0, Information published by TI regarding third-party products or services.
Customers are responsible for. Thermal Resistance Typical, Note 1. Balanced Propagation Delay and Transition Times. Use of such information may require a license from a third party under the patents or other intellectual property.
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74HCT (Philips) – Octal D-type flip-flop; positive edge-trigger; 3-state
Prerequisite for Switching Specifications. TI is not responsible or liable for any such statements. Input Rise and Fall Time.
Testing and other quality control techniques are used to the extent TI. Maximum Lead Temperature Soldering 10s. C Datashfet is used to determine the dynamic power consumption, per package.
TI assumes no liability for applications assistance or customer product design. To minimize the risks associated with customer products. All linear dimensions are in millimeters. Customers should obtain the latest relevant information before placing.